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Wide bandgap compound semiconductors for superior high-voltage unipolar power devices

IEEE Transactions on Electron Devices · 1994 · Vol. 41(8) · pp. 1481–1483
T. Paul ChowR. Tyagi

Abstract

This paper presents a critical evaluation of the performance capabilities of various wide bandgap semiconductors for high power and high frequency unipolar electronic devices. Seven different figures of merit have been analyzed. Theoretical calculations show that besides diamond and SiC, compounds like AlN, GaN, InN, and ZnO, and the intermetallics (Ga/sub x/In/sub 1-x/N, Al/sub x/In/sub 1-x/N, Al/sub x/Ga/sub 1-x/N, and (AlN)/sub x/(SiC)/sub 1-x/) offer several orders of magnitude improvement in the on-resistance and in the potential for successful operation at higher temperatures.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Silicon Carbide Semiconductor TechnologiesSemiconductor materials and devicesGaN-based semiconductor devices and materialsBand gapMaterials scienceSemiconductorWide-bandgap semiconductorCompound semiconductorOptoelectronicsDiamondFigure of meritIntermetallicNanotechnology
Citations
480
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9.51
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8
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Cited by
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References
Optimum semiconductors for high-power electronics
IEEE Transactions on Electron Devices · 1989 · 606 citations
Comparison of 6H-SiC, 3C-SiC, and Si for power devices
IEEE Transactions on Electron Devices · 1993 · 1,102 citations
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