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Silicon on insulator material technology
Electronics Letters · 1995 · Vol. 31(14) · pp. 1201–1202
M. Bruel✉(CEA Grenoble)
Abstract
A silicon on insulator material technology based on wafer bonding is described, in which a heat treatment induces an in-depth microslicing of one of the two bonded wafers previously implanted with hydrogen. The basic phenomena, and the first physical and electrical characterisations are discussed briefly.
3D IC and TSV technologiesSilicon and Solar Cell TechnologiesAdvanced Surface Polishing TechniquesWaferSilicon on insulatorMaterials scienceSiliconWafer bondingInsulator (electricity)OptoelectronicsEngineering physicsElectronic engineeringElectrical engineering
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