Advanced Surface Polishing Techniques

This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing. It covers topics such as material removal mechanisms, molecular dynamics simulation, ultra-precision grinding, surface and subsurface damage, nanometric cutting, magnetorheological finishing, polishing slurry chemistry, and tool wear.

Journals publishing in this area

1

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

ISSN 0277-786X8,885 articles in this topic

234h-index

436.5KArticles

1.9MCitations

2

International Journal of Advanced Manufacturing Technology

The International Journal of Advanced Manufacturing Technology

ISSN 0268-37687,025 articles in this topic

197h-index

3.24Impact

30.3KArticles

708.5KCitations

3

Journal of Materials Processing Technology

ISSN 0924-01362,580 articles in this topic

252h-index

6.91Impact

18.6KArticles

749.2KCitations

4

Materials Today Proceedings

ISSN 2214-78531,720 articles in this topic

141h-index

4.07Impact

41.6KArticles

482.6KCitations

5

Wear

ISSN 0043-16481,139 articles in this topic

240h-index

4.80Impact

23.9KArticles

712.9KCitations

6

Journal of materials research/Pratt's guide to venture capital sources

ISSN 0884-1616478 articles in this topic

210h-index

2.18Impact

16.1KArticles

485.2KCitations

7

International journal of machine tools and maintenance engineering.

ISSN 2707-45446 articles in this topic

1h-index

0.11Impact

31Articles

3Citations