3D IC and TSV technologies

This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.

Journals publishing in this area

1

International Journal of Electronics and Microcircuits

ISSN 2708-44932 articles in this topic

1h-index

0.11Impact

40Articles

4Citations