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Laser ablation and micromachining with ultrashort laser pulses

IEEE Journal of Quantum Electronics · 1997 · Vol. 33(10) · pp. 1706–1716
X. LiuD. DuG. Mourou

Abstract

The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required.

Laser Material Processing TechniquesOcular and Laser Science ResearchLaser-induced spectroscopy and plasmaUltrashort pulse laserMaterials scienceLaserSurface micromachiningOpticsUltrashort pulseX-ray laserFemtosecond pulse shapingLaser ablationFemtosecond
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