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Separation of film thickness and grain boundary strengthening effects in Al thin films on Si

Journal of materials research/Pratt's guide to venture capital sources · 1992 · Vol. 7(8) · pp. 2040–2048

Ramnath Venkatraman✉(Stanford University)J. C. Bravman(Stanford University)

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Metal and Thin Film Mechanics Semiconductor materials and devices Copper Interconnects and ReliabilityMaterials scienceGrain boundaryGrain sizeFlow stressGrain boundary strengtheningComposite materialStress (linguistics)Tension (geology)Thin filmCompression (physics)

Funding

Semiconductor Research Corporation

Citations

346

FWCI

20.06

field-weighted impact

References

24

Percentile

100%

vs. same field & year

Citations per year

Cited by

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References

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history

IEEE Transactions on Electron Devices · 1987 · 584 citations

Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques

Journal of materials research/Pratt's guide to venture capital sources · 1986 · 341 citations

Mechanical metallurgy

Journal of the Franklin Institute · 1962 · 4,398 citations

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