articleTop 1% cited
Effects of Creep and Thermal Drift on Modulus Measurement Using Depth-sensing Indentation
Journal of materials research/Pratt's guide to venture capital sources · 2002 · Vol. 17(3) · pp. 660–668
Gang Feng✉(University of Hong Kong)A.H.W. Ngan(University of Hong Kong)
Metal and Thin Film MechanicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationCreepMaterials scienceViscoelasticityIndentationModulusThermalDisplacement (psychology)Composite materialYoung's modulusElastic modulus
Citations
339
FWCI
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field-weighted impact
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References
On the generality of the relationship among contact stiffness, contact area, and elastic modulus during indentation
Journal of materials research/Pratt's guide to venture capital sources · 1992 · 1,522 citations
An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
Journal of materials research/Pratt's guide to venture capital sources · 1992 · 26,236 citations
A method for interpreting the data from depth-sensing indentation instruments
Journal of materials research/Pratt's guide to venture capital sources · 1986 · 2,800 citations
A critical examination of the fundamental relations used in the analysis of nanoindentation data
Journal of materials research/Pratt's guide to venture capital sources · 1999 · 439 citations
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