articleTop 10% cited
Mechanical properties of nano-silver joints as die attach materials
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Electronic Packaging and Soldering TechnologiesNanomaterials and Printing Technologies3D IC and TSV technologiesMaterials scienceMicroelectronicsNanoscopic scaleCeramicNano-Ultimate tensile strengthDie (integrated circuit)Silver NanoComposite materialMaterials processing
Citations
380
FWCI
11.32
field-weighted impact
References
84
Percentile
99%
vs. same field & year
Citations per year
References
Shape Control of Colloidal Metal Nanocrystals
Small · 2008 · 2,370 citations
Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials
Journal of Materials Chemistry · 2010 · 734 citations
Deformation and fracture mechanics of engineering materials
Materials & Design (1980-2015) · 1984 · 1,531 citations
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