articleTop 10% cited
Stresses in thin films: The relevance of grain boundaries and impurities
Thin Solid Films · 1976 · Vol. 34(2) · pp. 185–190
R. W. Hoffman✉(Case Western Reserve University)
Metal and Thin Film MechanicsCopper Interconnects and ReliabilityAdhesion, Friction, and Surface InteractionsImpurityGrain boundaryMaterials scienceThin filmRelevance (law)MetallurgyNanotechnologyChemistryMicrostructurePolitical science
Citations
458
FWCI
7.24
field-weighted impact
References
12
Percentile
97%
vs. same field & year
Citations per year
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