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Stress-related effects in thin films
Thin Solid Films · 1989 · Vol. 171(1) · pp. 5–31
John A. Thornton✉(University of Illinois Urbana-Champaign)David W. Hoffman(Ford Motor Company (United States))
Metal and Thin Film MechanicsCopper Interconnects and ReliabilityDiamond and Carbon-based Materials ResearchMaterials scienceCoatingStress (linguistics)HillockComposite materialSubstrate (aquarium)Thin filmMelting pointAluminiumDiffusion
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References
Thin Film Phenomena
Journal of The Electrochemical Society · 1970 · 2,011 citations
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