articleTop 10% cited
Cracking of thin bonded films in residual tension
International Journal of Solids and Structures · 1992 · Vol. 29(13) · pp. 1657–1675
Jack Beuth✉(Harvard University)
Metal and Thin Film MechanicsElectronic Packaging and Soldering TechnologiesMetal Forming Simulation TechniquesMaterials scienceCrackingComposite materialTension (geology)Residual stressResidualStructural engineeringUltimate tensile strengthEngineeringComputer science
Citations
634
FWCI
8.41
field-weighted impact
References
21
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98%
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References
Discussion: “Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading” (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460–466)
Journal of Applied Mechanics · 1969 · 1,133 citations
<i>Numerical Recipes, The Art of Scientific Computing</i>
American Journal of Physics · 1987 · 10,031 citations
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