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Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review

Energy · 2020 · Vol. 216 · pp. 119223–119223
Ziqiang HeYunfei YanZhien Zhang
Heat Transfer and OptimizationHeat Transfer and Boiling StudiesThermal properties of materialsHeat sinkElectronicsThermal management of electronic devices and systemsHeat transferHigh heatHeat fluxThermalMiniaturizationMechanical engineeringMaterials science

Funding

  • National Natural Science Foundation of China
  • Natural Science Foundation of Chongqing
Citations
769
FWCI
34.94
field-weighted impact
References
331
Percentile
100%
vs. same field & year
Citations per year
References
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Process Safety and Environmental Protection · 1998 · 300 citations
Cramming More Components Onto Integrated Circuits
Proceedings of the IEEE · 1998 · 5,785 citations
Investigation of heat transfer in rectangular microchannels
International Journal of Heat and Mass Transfer · 2005 · 813 citations
On connecting large vessels to small. The meaning of Murray's law.
The Journal of General Physiology · 1981 · 650 citations
The Singularity Is near: When Humans Transcend Biology
Foreign Affairs · 2006 · 3,453 citations
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