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Fabrication of a gradient nano-micro-structured surface layer on bulk copper by means of a surface mechanical grinding treatment

Scripta Materialia · 2008 · Vol. 59(5) · pp. 546–549
Wenwen LiN.R. TaoK. Lu
Microstructure and mechanical propertiesSurface Treatment and Residual StressMetal and Thin Film MechanicsMaterials scienceCopperGrindingSurface layerFabricationLayer (electronics)Nano-Composite materialGrain sizeMetallurgy
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