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Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
Journal of Alloys and Compounds · 2003 · Vol. 352(1-2) · pp. 226–236
Electronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy PropertiesIntermetallicSolderingMaterials scienceWhiskersAlloyBrittlenessMetallurgySubstrate (aquarium)CopperComposite material
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