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Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites

Polymer Degradation and Stability · 2005 · Vol. 91(7) · pp. 1629–1636
A. S. LuytJ. A. MolefiH. Krump
Polymer Nanocomposites and PropertiesNatural Fiber Reinforced CompositesPolymer crystallization and propertiesLinear low-density polyethyleneLow-density polyethyleneMaterials scienceComposite materialCopperPolyethylenePercolation thresholdPolymerThermal stabilityMelt flow index

Funding

  • Center for Evolutionary and Theoretical Immunology
  • National Research Foundation
  • Universiteit van die Vrystaat
Citations
355
FWCI
6.47
field-weighted impact
References
32
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97%
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Citations per year
Cited by
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References
Thermal conductivity, thermal diffusivity, and specific heat capacity of particle filled polypropylene
Composites Part A Applied Science and Manufacturing · 2004 · 405 citations
Mechanical properties of polymers and composites
Polymer · 1975 · 1,482 citations
Journal of Materials Science
Journal of Materials Science · 2013 · 760 citations
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Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites · Scinovex