reviewTop 1% cited
A review of mechanical properties of lead-free solders for electronic packaging
Journal of Materials Science · 2009 · Vol. 44(5) · pp. 1141–1158
Hongtao Ma✉(Auburn University)Jeffrey C. Suhling(Auburn University)
Electronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesSolderingMaterials scienceCreepViscoplasticityMicrostructureIsothermal processTemperature cyclingCharacterization (materials science)Reliability (semiconductor)Joint (building)
Citations
581
FWCI
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References
82
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Citations per year
References
A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials
Journal of Applied Physics · 1963 · 2,269 citations
Diffusional Viscosity of a Polycrystalline Solid
Journal of Applied Physics · 1950 · 2,439 citations
A first report on deformation-mechanism maps
Acta Metallurgica · 1972 · 1,012 citations
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